EX3-402 is a two-part thermally conductive silicone adhesive developed as a 1:1 mixed system. This thermal conductive silicone glue adhesive is a paste that is an addition curing via a platinum cure system. EX3-402 is a thermally conductive RTV silicone adhesive that has a pot time of 10 minutes, is cured in 60 minutes at room temperature or will cure in 5 minutes with the addition of heat at 150ºC. It is white in color before and after curing. This thermally conductive silicone RTV is 100% solids with no cure by-products, lending to its thermal conductivity of 1.0 W/mK, a high tensile strength of 500 PSI and viscosity of 50,000 cps. Typically used as a coupling agent for electronic components, especially those that require thermal dissipation, it also has both low- and high-temperature mechanical stability and chemical stability. A thermally conductive silicone sealant is best suited for coupling heat sinks in electronic applications.
A performance thermally conductive liquid gap filling material. It is formulated to develop a very soft, form in place elastomer, ideal for coupling hot PC board components to heat sinks. It is supplied as a two part, 1:1 mixed system that will cure at room temperature and can be accelerated with the addition of heat. This product is superior to cured thermal pad material because using a paste approach offers infinite thickness variations with little or no stress to sensitive components during assembly.