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Thermally Conductive Vibration-Dampening Liquid Silicone Gap Filler, 1.0 W/mK

Exonic Thermally Conductive Vibration Dampening Liquid Silicone Gap Filler


 
Starting at: $36.69

Price with Selected Options: $36.69
Volume Pricing: available for large volume purchases. Contact one of our Product Specialist for details. Request Custom Quote

Availability: Usually Ships in 3 to 5 Days
Product Code: EX3-402


Size (S402):


2-Part Dispensing Accessories:


Quantity:  
Description Product Technical Specs Typical Applications
 

EX3-402 is a two-part thermally conductive silicone adhesive developed as a 1:1 mixed system. This thermal conductive silicone glue adhesive is a paste that is an addition curing via a platinum cure system. EX3-402 is a thermally conductive RTV silicone adhesive that has a pot time of 10 minutes, is cured in 60 minutes at room temperature or will cure in 5 minutes with the addition of heat at 150ºC. It is white in color before and after curing. This thermally conductive silicone RTV is 100% solids with no cure by-products, lending to its thermal conductivity of 1.0 W/mK, a high tensile strength of 500 PSI and viscosity of 50,000 cps. Typically used as a coupling agent for electronic components, especially those that require thermal dissipation, it also has both low- and high-temperature mechanical stability and chemical stability. A thermally conductive silicone sealant is best suited for coupling heat sinks in electronic applications.

Features & Specifications

  • Item #: EX3-402
  • Description: 1 W/mK Thermally Conductive Vibration Dampening Liquid Silicone Gap Filler
  • Parts: 2-Part
  • Consistency: Paste
  • Product Use: Thermally Conductive
  • Cure Type: Addition
  • Cure System: Platinum
  • Room Temperature Cure Time (Hours): 1
  • Cure Time Other (UV or Heat) ( Mins): 5 @ 150C
  • Specific Gravity: 2.4
  • Durometer: 30
  • Shore Scale: Shore 00
  • Viscosity (cPs): 50000
  • Color: White
  • Comments: Gap Filler Thermally Conductive Silicone Rubber
  • Equivalents: Bergquist 1000
Features

A performance thermally conductive liquid gap filling material. It is formulated to develop a very soft, form in place elastomer, ideal for coupling hot PC board components to heat sinks. It is supplied as a two part, 1:1 mixed system that will cure at room temperature and can be accelerated with the addition of heat. This product is superior to cured thermal pad material because using a paste approach offers infinite thickness variations with little or no stress to sensitive components during assembly.

  • Thermal conductivity: 1.0 W/m-K>
  • Excellent slump resistance (stays in place)
  • Ultra-conforming, with excellent wet-out for low stress interface applications
  • 100% Solids – no cure by-products
  • Excellent low and high temperature mechanical and chemical stability
  • No odor or byproducts
  • Convenient 1:1 mix ratio
Need A Custom Solution?
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