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A performance thermally conductive liquid gap filling material. It is formulated to develop as a low viscosity liquid that allows the product to self-level in the application. In addition it develops a very soft, form in place elastomer, ideal for coupling hot PC board components to heat sinks. It is supplied as a two part, 1:1 mixed system that will cure at room temperature and can be accelerated with the addition of heat. This product is superior to cured thermal pad material because using a paste approach offers infinite thickness variations with little or no stress to sensitive components during assembly.