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Exonic Self-Leveling 2.0 W/m-K Thermally Conductive Liquid Silicone Gap Filler

Exonic Self-Leveling 2.0 W/m-K Thermally Conductive Liquid Silicone Gap Filler


 
Starting at: $37.08

Price with Selected Options: $37.08

Availability: Usually Ships in 3 to 5 Days
Product Code: EXS-405


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Description Product Technical Specs Typical Applications
 
Exonic Self-Leveling 2.0 W/m-K Thermally Conductive Liquid Silicone Gap Filler
Features

A performance thermally conductive liquid gap filling material. It is formulated to develop as a low viscosity liquid that allows the product to self-level in the application. In addition it develops a very soft, form in place elastomer, ideal for coupling hot PC board components to heat sinks. It is supplied as a two part, 1:1 mixed system that will cure at room temperature and can be accelerated with the addition of heat. This product is superior to cured thermal pad material because using a paste approach offers infinite thickness variations with little or no stress to sensitive components during assembly.

  • Thermal conductivity:21.0 W/m-K
  • Ultra-conforming, with excellent wet-out for low stress interface applications
  • 100% Solids – no cure by-products
  • Excellent low and high temperature mechanical and chemical stability
  • No odor or byproducts
  • Convenient 1:1 mix ratio
Need A Custom Solution?
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