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Exonic 2 W/mK Thermally Conductive Vibration Dampening Liquid Silicone Gap Filler

Exonic 2 W/mK Thermally Conductive Vibration Dampening Liquid Silicone Gap Filler


 
Starting at: $32.76

Price with Selected Options: $32.76

Availability: Usually Ships in 3 to 5 Days


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Description Product Technical Specs Typical Applications
 
Exonic 2 W/mK Thermally Conductive Vibration Dampening Liquid Silicone Gap Filler
Features
A performance thermally conductive liquid gap filling material. It is formulated to develop a very soft, form in place elastomer, ideal for coupling hot PC board components to heat sinks. It is supplied as a two part, 1:1 mixed system that will cure at room temperature and can be accelerated with the addition of heat. This product is superior to cured thermal pad material because using a paste approach offers infinite thickness variations with little or no stress to sensitive components during assembly.

  • Thermal conductivity: 2.0 W/m-K
  • Extremely-conforming, designed for fragile and low-stress applications
  • 100% Solids – no cure by-products
  • Excellent low and high temperature mechanical and chemical stability
  • No odor or byproducts
  • Convenient 1:1 mix ratio

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