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Exonic 2.2 W/mK Thermally Conductive Silicone Gap Filler
Exonic 2.2 W/mK Thermally Conductive Silicone Gap Filler


 
Starting at: $41.63

Price with Selected Options: $41.63
Note: Discounted Pricing available for large volume purchases. Contact one of our Product Specialist for details. Request Custom Quote

Availability: Usually Ships in 3 to 5 Days
Product Code: EX3-404


Size (S404):

2-Part Dispensing Accessories:

Quantity:  
Description Product Technical Specs Typical Applications
 
Exonic 2.2 W/mK Thermally Conductive Silicone Gap Filler
Features

A performance thermally conductive liquid gap filling material. It is formulated to develop a very soft, form in place elastomer, ideal for coupling hot PC board components to heat sinks. It is supplied as a two part, 1:1 mixed system that will cure at room temperature and can be accelerated with the addition of heat. This product is superior to cured thermal pad material because using a paste approach offers infinite thickness variations with little or no stress to sensitive components during assembly.

  • Thermal conductivity: Greater than 2.2 W/m-K
  • Extremely-conforming, designed for fragile and low-stress applications
  • 100% Solids – no cure by-products
  • Excellent low and high temperature mechanical and chemical stability
  • No odor or byproducts
  • Convenient 1:1 mix ratio
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